In this EDA Expert episode, we tackle the real-world challenges of analog simulation—from FinFET reliability to RF and transient analysis. Join Scott Guyton, Director Solutions Architecture, at Siemens EDA as we explore smarter strategies for smaller design teams, the PACE framework, and how tools like Analog FastSPICE and Solido are shaping the future. Plus, listen to insights on AI, simulation scalability, and why it’s time to rethink your verification flow.
Further product details
Analog FastSPICE
Industry standard SPICE simulation for nm analog, RF, mixed-signal, and custom digital
Solido Characterization Suite
Comprehensive suite of fast, accurate library characterization tools powered by machine learning. Significantly reduces standard cell, custom cell and memory characterization time and resources, while delivering production-accurate Liberty models and statistical data.
Solido Design Environment
A comprehensive AI-powered design environment for all SPICE-level design and verification, and is a single unified solution for nominal and variation analysis. Used by thousands of designers to produce the most competitive products in hp computing, AI, IoT, automotive and mobile applications.
Solido IP Validation Suite
The industry’s first end-to-end silicon IP quality assurance for IC design. Solido IP Validation suite offers the fastest, most comprehensive integrated IP validation solution, providing complete, seamless IP QA from design to tape-out, across all design views and IP revisions.
Solido Simulation Suite
An integrated suite of AI-accelerated SPICE, Fast SPICE and mixed-signal simulators designed to help customers dramatically accelerate critical design and verification tasks for their next-generation analog, mixed-signal and custom IC designs.
