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Siemens EDA User2User Europe

Event Details

Event Description

The perfect opportunity to learn

User2User is the perfect opportunity to learn, share and network with fellow technical experts who design leading-edge products using Siemens EDA tools.

Dedicated to end-users of Siemens EDA solutions, this conference is free to attend and includes innovative keynotes from industry leaders, enriching technical sessions as well as a chance to network with colleagues and peers.

If you will be at the conference and would like to discuss anything with us, send a message using the form below.

The full programme includes papers on these topics

  • Design For Test & Embedded Analytics
  • Electronic System Design/PCB Design analysis and manufacturing
  • Functional Design & Verification
  • Hardware Assisted Verification
  • High Level Synthesis: Digital design in C++/SystemC 
  • Custom IC Verification 
  • IC Backend 
  • Semiconductor packaging design, analysis and manufacturing

Keynotes

Enabling imagination – An integrated approach to system design Mike Ellow

Mike Ellow is the Executive Vice President of Electronic Design Automation (EDA) Global Sales Services and Customer Support for Siemens in North America.

Delivering Silicon at Cloud Scale Ronen Laviv

Ronen Laviv is the Enterprise Account Manager and EDA Sales Consultant at Amazon Web Services (AWS) based in Israel.

Technical breakouts

  • IC Backend Track 1
    • Improving the accuracy of Design for Manufacturability (DFM) sign-off checks with machine learning
    • Signoff with Calibre as platform independent application
    • Utilizing Calibre Tools for Chipfinishing within a Markefile
  • IC Backend Track 2
    • PERC-LDL Auto Waivers flow applied to Voltage Dependent Rules in BCD technologies
    • Mission IR Possible – Full Chip IR Drop Analysis of CMOS Cine-Image Sensor with Mpower
  • Custom IC Verification
    • Symphony Pro enablement in STMicroelectronics SmartPower Technologies
    • How AWS cloud compute helps scale custom IC verification workloads
    • PLL Design and Simulation using the Advanced SPICE technology
    • Accelerating verification of high frequency PLLs for Wireless Application in a Smarter World
  • Design for Test & Embedded Analytics
    • Advancing DFT with the Power of AI: Grand challenges

Book your place