Event Details
Event Description
As Siemens EDA’s European distribution partner for its Custom IC design tools, EDA Solutions is excited to be joining their team at the European TSMC OIP Ecosystem Forum.
Siemens will have a booth at the TSMC OIP Europe event where the team will be accompanied by EDA Solutions CEO, Paul Double, Business Development Director, Pete Davy and Account Manager, Andy Betts.
Stop by to discuss chip design and the latest advances in 3DIC system design.
If you will be at the conference and would like to discuss anything with us, send a message using the form below.