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LATEST NEWS
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Tanner adds 3D parasitic extraction to L-Edit |
18 Apr 2007 |
| Tanner EDA has added hierarchical 3D resistance and capacitance (RC) extraction capabilities to its L-Edit chip layout tool for analogue and mixed-signal design. more... |
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Accelerated system-level MEMS development with SoftMEMS |
09 Apr 2007 |
| EDA Solutions (Southampton, UK), the exclusive European representative for Tanner EDA and MOSIS multi-project wafer services for IC fabrication, has signed a representation agreement for Germany, the UK, Benelux and the Nordic region with SoftMEMS to market and support its open-platform, system-level design environment, MEMS Pro. more... |
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Shared wafer service makes high-performance RF chip fabrication affordable |
09 Mar 2007 |
| MOSIS, a provider of low-cost prototyping and small volume production services for custom ASICs, announces prototype and low volume fabrication access to IBM's fourth generation foundry technology, 8WL, the 130 nanometer (nm) silicon germanium (SiGe) bipolar complementary metal oxide semiconductor (BiCMOS) process. more... |
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Affordable access to very high-speed SiGe:C BiCMOS processes |
08 Nov 2006 |
| IHP and Europractice collaboration gives Tanner EDA users affordable access to very high-speed SiGe:C BiCMOS processes. more... |
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Peter Kaiser heads new Munich office for EDA Solutions |
07 Aug 2006 |
| EDA Solutions, the exclusive European representative for Tanner EDA's analogue and mixed-signal IC/MEMS design tools, and for MOSIS' MPW and small volume wafer fabrication services, has appointed Munich-based Peter Kaiser to head up its first overseas office. more... |
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